page 1 of 6 the big deal ? ultra high ip3 ? broadband high dynamic range without external matching components product overview PHA-101-D+ (rohs compliant) is an advanced wideband amplifer die fabricated using e-phemt technol - ogy and offers extremely high dynamic range over a broad frequency and with low noise fgure. in addition, the PHA-101-D+ has good input and output return loss over a broad frequency range without the need for external matching components. moreover, the PHA-101-D+ has demonstrated excellent reliability and has low thermal resistance. feature advantages broad band: 0.05 to 1.5 ghz broadband covering primary wireless communications bands: cellular, pcs, lte extremely high ip3 versus dc power consumption 45 dbm typical at 0.9 ghz the PHA-101-D+ matches industry leading ip3 performance relative to device size and power consumption. the combination of the design and e-phemt structure provides enhanced linearity over a broad frequency range as evidence in the ip3 being typically 20 db above the p 1db point. this feature makes this amplifer ideal for use in: ? driver amplifers for complex waveform up converter paths ? drivers in linearized transmit systems ? secondary amplifers in ultra high dynamic range receivers no external matching components required mini-circuits PHA-101-D+ provides input and output return loss of 9.9-12.5 db up to 1.5 ghz without the need for any external matching components unpackaged die enables the user to integrate the amplifer directly into hybrids. key features PHA-101-D+ 50 ? 0.05 to 1.5 ghz ultra high dynamic range monolithic amplifer die notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com
page 2 of 6 product features ? high ip3, 45 dbm typ. at 0.9 ghz ? gain, 15.2 db typ. at 0.9 ghz ? high pout, p1db 26 dbm typ. at 0.9 ghz ? low noise fgure, 4.0 db at 0.9 ghz ? no external matching components required rev. or m157316 PHA-101-D+ mcl ny 160728 general description PHA-101-D+ (rohs compliant) is an advanced wideband amplifer fabricated using e-phemt technology and offers extremely high dynamic range over a broad frequency range and with low noise fgure. in addition, the PHA-101-D+ has good input and output return loss over a broad frequency range without the need for external matching components and has low thermal resistance. typical applications ? base station infrastructure ? catv ? lte PHA-101-D+ ordering information: refer to last page pad description rf in rf input pad. this pad requires the use of an external dc blocking capacitor chosen for the frequency of operation. rf-out and dc-in rf output and bias pad. dc voltage is present on this pad; therefore a dc block - ing capacitor is necessary for proper operation. an rf choke is needed to feed dc bias without loss of rf signal due to the bias connection. gnd connections to ground. bottom of die. rf-in rf-out and dc-in gnd simplifed schematic and pad description 50 ? 0.05 to 1.5 ghz ultra high dynamic range monolithic amplifer die notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com +rohs compliant the +suffix identifies rohs compliance. see our web site for rohs compliance methodologies and qualifications
page 3 of 6 absolute maximum ratings 4 parameter ratings operating temperature (ground lead) -40c to 85c operating current at 9v 360 ma power dissipation 3.25 w input power (cw) +24 dbm (5 minutes max.) +20 dbm (continuous) dc voltage at rf-out & dc-in pad 11 v 4. permanent damage may occur if any of these limits are exceeded. electrical maximum ratings are not intended for continuous normal operation. 1. measured on mini-circuits characterization test board. die packaged in sot-89 package and soldered on tb-869+. 2. tested at pout=8dbm / tone. 3. (current at 85c current at -45c)/130 electrical specifcations 1 at 25c, 50 ohms, unless noted parameter condition (mhz) vd=9v 1 units min. typ. max. frequency range 0.05 1.5 ghz gain 50 15.3 db 450 15.5 900 15.2 1500 15.0 input return loss 50 10.7 db 450 11.4 900 10.7 1500 9.5 output return loss 50 13.2 db 450 10.7 900 10.2 1500 8.9 reverse isolation 20.5 db output power @1db compression 50 25.3 dbm 450 26.2 900 25.8 1500 25.4 output ip3 2 50 47.0 dbm 450 44.3 900 45.0 1500 43.8 noise fgure 50 4.1 db 450 3.9 900 4.0 1500 4.2 device operating voltage 9.0 v device operating current 182 220 ma device current variation vs. temperature 3 -4 a/c device current variation vs voltage 0.024 ma/mv thermal resistance, junction-to-ground lead at 85c stage temperature 20 c/w PHA-101-D+ monolithic e-phemt mmic amplifer die notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com
page 4 of 6 characterization test circuit die layout critical dimensions parameter values die thickness, m 100 die width, m 1060 die length, m 800 bond pad size, m 75 x 150 fig 3. bonding pad positions bonding pad position (dimensions in m, typical) fig 2. die layout fig 1 . block diagram of test circuit used for characterization. die packaged in sot-89 package and soldered on tb-869+. gain, return loss, output power at 1db compression (p1 db) , output ip3 (oip3) and noise fgure measured using agilents n5242a pna-x microwave network analyzer. conditions: 1. gain and return loss: pin= -25dbm 2. output ip3 (oip3): two tones, spaced 1 mhz apart, 8 dbm/tone at output. PHA-101-D+ component value size part number manufacturer c1, c2, c3 150 pf 0603 grm1885c1h151ja01d murata c4 0.01 f 0603 grm188r71h103ka01d murata c5 10 f 1206 grm31cr61h106ka12l murata l1 390 nh 0505 0805cs-391xjec coilcraft monolithic e-phemt mmic amplifer die notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com
page 5 of 6 assembly diagram assembly and handling procedure 1. storage dice should be stored in a dry nitrogen purged desiccators or equivalent. 2. esd mmic e-phemt amplifer dice are susceptible to electrostatic and mechanical damage. die are supplied in antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta tion. devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter esd damage to dice. 3. die attach the die mounting surface must be clean and fat. using conductive silver flled epoxy, recommended epoxies are diemat dm6030hk-pt/h579 or ablestik 84-1lmisr4. apply suffcient epoxy to meet required epoxy bond line thickness, epoxy fllet height and epoxy coverage around total die periphery. parts shall be cured in a nitrogen flled atmosphere per manufacturers cure condition. it is recommended to use antistatic die pick up tools only. 4. wire bonding bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. thermosonic bonding is used with minimized ultrasonic content. bond force, time, ultrasonic power and temperature are all critical parameters. suggested wire is pure gold, 1 mil diameter. bonds must be made from the bond pads on the die to the package or substrate. all bond wires should be kept as short as low as reasonable to minimize performance degradation due to undesirable series inductance. recommended wire length, typical wire wire length (mm) wire loop height (mm) rf in 1.90 0.50 rf-out + dc in 1.65 0.50 ground 1 1.15 0.50 ground 2 0.35 0.15 PHA-101-D+ monolithic e-phemt mmic amplifer die notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com
page 6 of 6 performance data data table swept graphs s-parameter (s2p files) data set with and without port extension (.zip fle) case style die die ordering and packaging information quantity, package model no. small, gel - pak: 5,10,50,100 kgd* medium ? , partial wafer: kgd*<5k large ? , full wafer PHA-101-Dg+ PHA-101-Dp+ PHA-101-Df+ ? available upon request contact sales representative refer to an-60-067 environmental ratings env08t1 additional notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp d. mini-circuits does not warrant the accuracy or completeness of the information, text, graphics and other items contained within this document and same are provided as an accommodation and on an as is basis, with all faults. e. purchasers of this part are solely responsible for proper storing, handling, assembly and processing of known good dice (including, without limitation, proper esd preventative measures, die preparation, die attach, wire bond ing and related assembly and test activities), and mini-circuits assumes no responsibility therefor or for environmental effects on known good dice. f. mini-circuits and the mini-circuits logo are registered trademarks of scientifc components corporation d/b/a mini- circuits. all other third-party trademarks are the property of their respective owners. a reference to any third-party trademark does not constitute or imply any endorsement, affliation, sponsorship, or recommendation by any such third-party of mini-circuits or its products. esd rating** human body model (hbm): class 1a (250 to <500v) in accordance with ansi/esd stm 5.1 - 2001 machine model (mm): class m1 (>25v) in accordance with ansi/esd stm5.2-1999 additional detailed technical information additional information is available on our dash board. *known good dice (kgd) means that the dice in question have been subjected to mini-circuits dc test performance criteria and measurement instructions and that the parametric data of such dice fall within a predefned range. while dc testing is not defnitive, it does help to provide a higher degree of confdence that dice are capable of meeting typical rf electrical parameters specifed by mini-circuits. ** tested in industry standard sot-89 package. PHA-101-D+ monolithic e-phemt mmic amplifer die notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com
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